1. Handling Object |
©ª50mm to ©ª300mm - WAFER |
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2. Range of Motion |
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2.1 Z Axis stroke |
300MM |
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2.2 T Axis range |
Min 340¨¬ |
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2.3 Maximum reach distance |
463.5mm(8inch below) 555mm(12inch) |
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2.4 Minimum working envelope with wafer |
¨ª250mm (12inch)
¨ª205mm(8inch below)
¨ª210(8inch below with mapping |
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2.5 Robot mounting flange (top or bottom) |
According to project required |
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2.6 Robot weight |
Max 29.5kgf |
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3.0 Wafer Check |
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3.1 Vacuum holding check |
Wafer chunk |
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3.2 Vacuum holding check |
Vacuum sensor display |
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4.End-effector |
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4.1 Vacuum - suction points |
One suction point |
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4.2 Type |
Fork / Tongue available |
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4.3 Contact type |
Non edge contact |
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4.4 Flatness |
0.05mm |
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4.5 Material |
Ceramic |
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4.6 Payload |
< 500g(Included End-Effector) |
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5.0 Repeatability |
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5.1 Z Axis |
¡¾0.05mm |
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5.2 T Axis |
¡¾0.05mm |
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5.3 R Axis |
¡¾0.05mm |
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6.0 Vacuum setting value |
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6.1 Setting point with vacuum sensor |
50Kpa |
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7.0 Teaching |
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7.1 Teaching Pendant |
Handheld size, user friendly.
Equip with emergency STOP button. |
By communication method |
7.2 Teaching position |
16 Stage position teaching data set. |
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8.0Power & Utility |
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8.1 Power |
AC 208V¡¾10% , 50/ 60Hz
Combination, Single Phase/ 12A |
With travelling axis : 15A
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8.2. Vacuum |
-80kpa or less
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9.0 Interface |
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9.1 Communication |
RS232C
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10.0 Optional |
Travelling Axis, Mapping Sensor |
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