| 1. Handling Object |
ø150mm to ø200mm Semiconductor wafer |
|
| 2. Range of Motion |
|
|
| 2.1 Z Axis stroke |
189~191 mm ( 190 mm ) |
|
| 2.2 T Axis range |
Min 340º |
|
| 2.3 Maximum reach distance |
390mm / Max Reach : 445mm |
|
| 2.4 Minimum working envelope with wafer |
RØ160
Mapping Type : RØ205 |
|
| 2.5 Robot mounting flange (top or bottom) |
According to project required |
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| 2.6 Robot weight |
Max 15kgf |
|
| 3.0 Wafer Check |
|
|
| 3.1 Vacuum holding check |
Wafer chunk |
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| 3.2 Vacuum holding check |
Vacuum sensor display |
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| 4.End-effector |
|
|
| 4.1 Vacuum - suction points |
One suction point |
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| 4.2 Type |
Fork / Tongue / Grip Type available |
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| 4.3 Contact type |
Non edge contact |
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| 4.4 Flatness |
0.05mm |
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| 4.5 Material |
Al /Ceramic |
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| 4.6 Payload |
< 200g(Included End-Effector) |
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| 5.0 Repeatability |
|
|
| 5.1 Z Axis |
±0.05mm |
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| 5.2 T Axis |
±0.05mm |
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| 5.3 R Axis |
±0.05mm |
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| 6.0 Vacuum setting value |
|
|
| 6.1 Setting point with vacuum sensor |
50Kpa |
|
| 7.0 Teaching |
|
|
| 7.1 Teaching Pendant |
Handheld size, user friendly. Equip with emergency STOP button. |
By communication method |
| 7.2 Teaching position |
16 Stage position teaching data set. |
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| 8.0 Power & Utility |
|
|
| 8.1 Power |
110 or 208V , 50/ 60Hz Combination, Single Phase/ 7A |
With travelling axis : 15A |
| 8.2. Vacuum |
-80kpa or less
|
|
| 9.0 Interface |
|
|
| 9.1 Communication |
RS232C |
|
Transfer from 5 inch to 8 inch semiconductor wafer 
