| 1. Handling Object |
2,4 & 6 inch (8 inch norch optional)
SEMI/JEDIA STD. wafer( Align with flat zone of wafer) |
|
| 2. Wafer handling method |
Back side vacuum chucking |
|
| 3. wafer handling confirmation |
Vacuum sensor with digital display |
|
| 4. Alignment time |
|
|
| 4.1 Chucking ( for centering ) |
≤ 10.0 sec/wafer |
|
| 4.2 Rotation axis (θ axis) |
Min 340º |
|
| 4.3 Up-Down(Z axis) |
50mm |
|
| 5.0 Repeatability |
|
|
| 5.1 XY direction |
± 0.3mm or less |
|
| 5.2 T direction |
± 0.3 degree or less |
|
| 6. Particle & Damage |
Compliance with ISO Class I
Damage or Scratch : No Damage & Scratch during grip, positioning, and transfer |
|
| 7. Anti-Electrostatic Requirements |
106~109 Ω/cm2 |
|
Transfer from 50mm*200mm LED wafer
